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Special solder paste for Android CPU soldering.

GW50 50G/217℃ DIM: 410*410*210MM G.W: 21.7KG QTY: 20/400PCS DIM: 195*75*90MM G.W: 1.05KG QTY: 1/20PCS CPG90 Beta 50G/199℃ DIM: 410*410*210MM QTY: 20/400PCS G.W: 21.90KG DIM: 195*75*90MM G.W: 1.06KG QTY: 1/20PCS CPG90 Beta 35G/199℃ DIM: 298*229*121MM QTY: 1/50PCS G.W: 2.19KG

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Telephone:

Product Description

Hong Kong Maintenance Guy Group

Service Hotline:

4006-883-993

Hong Kong Maintenance Guy Group

WeChat Official Account


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