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Special solder paste for Android CPU soldering.
GW50
50G/217℃
DIM: 410*410*210MM
G.W: 21.7KG
QTY: 20/400PCS
DIM: 195*75*90MM
G.W: 1.05KG
QTY: 1/20PCS
CPG90 Beta
50G/199℃
DIM: 410*410*210MM
QTY: 20/400PCS
G.W: 21.90KG
DIM: 195*75*90MM
G.W: 1.06KG
QTY: 1/20PCS
CPG90 Beta
35G/199℃
DIM: 298*229*121MM
QTY: 1/50PCS
G.W: 2.19KG
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